Accession Number:

ADA445348

Title:

Special Technology Area Review on Electronics Packaging

Descriptive Note:

Corporate Author:

OFFICE OF THE UNDER SECRETARY OF DEFENSE (ACQUISITION) WASHINGTON DC

Personal Author(s):

Report Date:

1993-07-01

Pagination or Media Count:

25.0

Abstract:

Electronic packaging technology dictates the cost, performance and reliability of almost all future commercial and military electronics equipment. These equipments will be the marketable products of an electronics industry which is projected to grow to 2.0 trillion dollars by the year 2000. A strong and growing dependency exists between our national defense capability and this electronics industry. Electronic packaging has traditionally been a shared responsibility of several industry sectors and specialty vendors. The packaging of integrated circuits constitutes a significant fraction of the product value provided by the device manufacturer, and additional value is added by circuit board specialists, frame manufacturers, subsystem and system assemblers, cable and connector companies and others involved in packaging the electronic equipments. New packaging technologies, which utilize minimally protected die of increasing complexity and fine line integrating substrates to achieve higher packaging densities, are reshaping the contributions of the various industry sectors. Each involved industry sector, including defense electronics, recognizes these changes and is adjusting to retain a significant future packaging role. However, the resulting plans and investments of both industry and government are unbalanced and lack coherence. DoD, with its strong and growing dependence on electronics, should, in its planning, coordination, and cooperative efforts, undertake to unify the various defense and industry efforts into a coherent plan that responds efficiently to the defined needs for electronic packaging. This report makes specific recommendations for 1 a coordinated plan for industry and defense, 2 significant augmentation of specific packaging technologies, 3 market initiative assistance, and 4 a timely response.

Subject Categories:

  • Electrical and Electronic Equipment
  • Containers and Packaging

Distribution Statement:

APPROVED FOR PUBLIC RELEASE