Accession Number:

ADA443252

Title:

Electronic Components for High-g Hardened Packaging

Descriptive Note:

Final rept. May-Dec 2004

Corporate Author:

ARMY RESEARCH LAB ABERDEEN PROVING GROUND MD

Personal Author(s):

Report Date:

2006-01-01

Pagination or Media Count:

29.0

Abstract:

A survey of packaging technology applicable to high-g environments is presented. Specifics of the artillery gun launch environment are discussed. The advantages and disadvantages of various external techniques including underfill and potting are also discussed. Discussion of the impact of the manufacturing process and resulting defects is included. Some key failure mechanisms are also identified.

Subject Categories:

  • Containers and Packaging
  • Ammunition and Explosives

Distribution Statement:

APPROVED FOR PUBLIC RELEASE