Electronic Components for High-g Hardened Packaging
Final rept. May-Dec 2004
ARMY RESEARCH LAB ABERDEEN PROVING GROUND MD
Pagination or Media Count:
A survey of packaging technology applicable to high-g environments is presented. Specifics of the artillery gun launch environment are discussed. The advantages and disadvantages of various external techniques including underfill and potting are also discussed. Discussion of the impact of the manufacturing process and resulting defects is included. Some key failure mechanisms are also identified.
- Containers and Packaging
- Ammunition and Explosives