Accession Number:

ADA439457

Title:

Thermo-Mechanical Response of Monolithic and NiTi Shape Memory Alloy Fiber Reinforced Sn-3.8Ag-0.7Cu Solder

Descriptive Note:

Master's thesis

Corporate Author:

NAVAL POSTGRADUATE SCHOOL MONTEREY CA

Personal Author(s):

Report Date:

2005-09-01

Pagination or Media Count:

89.0

Abstract:

In electronic packaging, the reliability of solders is a critical issue, since serve as both electrical and mechanical connections. The most common failures arise from the thermo-mechanical fatigue TMF of solders, due to mismatches in the coefficient of thermal expansion between the Si-chip and the printed circuit board. In order to meet the demands of miniaturization and enhanced performance in severe environments, a novel adaptive Tin-Silver-Copper SnAgCu solder reinforced with NiTi shape-memory alloy particles or fiber developed. An experimental apparatus has been designed to investigate the thermo-mechanical straincontrolled fatigue life of the solder during both single and multiple thermal cycling under double-shear loading. For comparison, thermo-mechanical single shear tests were also performed in monolithic Tin- Silver-Copper solder and in solder reinforced with Cu fiber. Also, micro-structural evaluation of the solders during the 5th cycle was possible using Scanning and Optical microcopy together with EDS analysis.

Subject Categories:

  • Metallurgy and Metallography
  • Thermodynamics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE