Accession Number:

ADA422721

Title:

Low Temperature Active Joining of Structural and Electronic Composites

Descriptive Note:

Final rept. 1 Aug 2000-1 Jan 2003

Corporate Author:

MATERIALS RESOURCES INTERNATIONAL LANSDALE PA

Personal Author(s):

Report Date:

2003-07-15

Pagination or Media Count:

64.0

Abstract:

This report covers the technical work conducted under contract DASG60-00-C-0056. MRi has successfully completed an evaluation of its active solder joining technology S-Bond for joining lightweight aluminum matrix ceramic composites Al-MMC, such as Al-SiC. This joining technology has been shown to have application in a range of applications for space platform structures and electronics, where Al-MMCs are finding application. S-Bond joining has joint capability from 190 - 350 C, depending on which S-Bond filler, Alloy 220 or Alloy 400 is used. Joint strengths ranged from 35 - 120 MPa which in most cases are better than epoxy joints and offer substantially higher thermal conductivity. SBond joining has been shown to be a versatile joining technology with ability to join most materials that would be used in lightweight structures and electronic components that might be used in space based platforms or missiles. The only limitation for the use of the technology would be the filler metal temperature range and the ultimate strengths of the joints. It is recommended that S-Bond joining proceed with individual application development

Subject Categories:

  • Laminates and Composite Materials
  • Properties of Metals and Alloys
  • Thermodynamics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE