Accession Number:

ADA422317

Title:

Processing of NiTi Reinforced Adaptive Solder for Electronic Packaging

Descriptive Note:

Master's thesis

Corporate Author:

NAVAL POSTGRADUATE SCHOOL MONTEREY CA

Personal Author(s):

Report Date:

2004-03-01

Pagination or Media Count:

65.0

Abstract:

Solder joints provide both electrical and mechanical interconnections between a silicon chip and the packaging substrate in an electronic application. The thermomechanical cycling TMC in the solder due to the mismatch of the coefficient of thermal expansion CTE between the silicon chip and the substrate causes numerous reliability challenges. This situation is aggravated by the ongoing transition to lead-free solders worldwide, and the trend towards larger, hotter-running chips. Therefore, improved solder joints, with higher resistance to creep and low-cycle fatigue, are necessary for future generations of microelectronics. This study reports in the development a process to fabricate solder joints with a fine distribution of shape memory alloys SMA NiTi particulates. The microstructure and interface zone of the as-reflowed solder-SMA composite has been characterized.

Subject Categories:

  • Couplers, Fasteners and Joints

Distribution Statement:

APPROVED FOR PUBLIC RELEASE