Study of The Physical Mechanisms of Ice Adhesion
Final rept. 15 Apr 1999-14 Jun 2003
THAYER SCHOOL OF ENGINEERING HANOVER NH
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In this research we have investigated main physical mechanisms of ice adhesion and have developed several novel deicing and anti-icing methods. The following mechanisms of ice adhesion have been studied experimentally and theoretically 1 electrostatic interactions between the electrical charge at the ice surface and the charge induced on a solid substrate 2 hydrogen bonding between water molecules and substrate atoms and 3 Liftshitz-van der Waals LVW dispersion forces. Using that basic knowledge gained in the first part of the project we have invented, tested and developed the following deicing and anti-icing technologies 1. Self-assembling mono-layer coating that drastically reduces adhesion of ice to metals. 2. Ice-electrolysis deicer. 3. High-frequency deicer. 4. Pulse electrothermal deicer. 5. Heat-storage deicer. 6. Lossy-dielectric deicer for high-voltage power lines. 7. HF-deicier for power lines. We have also invented and developed three novel electrical methods capable to either decrease or increase friction on snow and ice. Five US and International patents were obtained and over 50 patent applications were submitted. One book and 15 scientific articles were published. The technologies were licensed to several US companies 9 licenses in total were issued. The first airplane with our novel pulse deicer is scheduled to fly by the end of this year.
- Snow, Ice and Permafrost