Induction Curing of a Phase-Toughened Adhesive
Final rept. Dec 2002-Feb 2003
ARMY RESEARCH LAB ABERDEEN PROVING GROUND MD
Pagination or Media Count:
Phase-toughened epoxydicyandiamide adhesives were loaded with magnetic particle filler and then cured by induction processing. The effect of induction field magnitude and exposure time on bonding strength of the loaded adhesives was characterized. At low magnetic field amplitudes, bond strength increased significantly with exposure time, with the highest strength bonds occurring after 60-min exposures. At high magnetic field amplitudes, bond strength increased only slightly with exposure time, so that significant bond strength was reached after 15 min of exposure. In general, the induction-cured adhesives exhibited lower bond strengths than comparable oven-cured adhesives. All of these strength trends were likely due to process- induced variations in the adhesive degree of cure, toughening phase development, or thermal degradation.
- Adhesives, Seals and Binders