Accession Number:

ADA413410

Title:

Thermal Management Research for Power Generation. Delivery Order 0002 - Volume 1: Plain Fin Array Cooler for Electronics Cooling

Descriptive Note:

Final rept. 1 Apr 2000-30 Oct 2002

Corporate Author:

UES INC DAYTON OH

Personal Author(s):

Report Date:

2002-12-01

Pagination or Media Count:

35.0

Abstract:

A fin array cooler was developed to cool a substrate of high-heat flux electronics. Plain copper fin strips were soldered onto the substrate to minimize the contact thermal resistance between the electronics and heat sink. Two new types of fin arrays based on offset fin strips and aligned fin strips were employed in order to mitigate the thermal stress problem found in the integral finned substrate concept. The cooler with different fin strip layouts was tested using polyalphaolefin as the coolant for flow Reynolds number variation from 53 to 482. The fin strip gaps of 0.13, 0.38, and 1.0 mm were experimented. Heat transfer data for different fin strip layouts were obtained under various operating conditions and compared. It was shown that, in general, the heat transfer coefficient was 29 to 36 percent higher for the offset fin strip layout than for the aligned fin strip layout. New heat transfer correlations for offset fin strip layout and aligned fin strip layout are presented.

Subject Categories:

  • Aircraft
  • Electrical and Electronic Equipment
  • Air Conditioning, Heating, Lighting and Ventilating

Distribution Statement:

APPROVED FOR PUBLIC RELEASE