Accession Number:

ADA411520

Title:

Development of Processable, Low Cure Shrinkage Adhesives

Descriptive Note:

Final rept. 15 Jul 2000-14 Jul 2002

Corporate Author:

POLYCOMP TECHNOLOGIES DEL MAR CA

Report Date:

2003-02-01

Pagination or Media Count:

73.0

Abstract:

Adhesively bonded structures offer weight savings, ease of fabrication, and absence of stress concentrations arising from holes and fasteners. However, the drawbacks of current high performance resins, i.e. high paste viscosity and chemical cure shrinkage, often present uncertainties in the quality and durability of the bondlines. This program presents methodologies and approaches that seek to mitigate these difficulties through innovative chemical modifications and blending of monomers.

Subject Categories:

  • Adhesives, Seals and Binders

Distribution Statement:

APPROVED FOR PUBLIC RELEASE