Thermochemical Response of Vinyl-Ester Resin
Final rept. Jan 1997-Jan 1998
ARMY RESEARCH LAB ABERDEEN PROVING GROUND MD WEAPONS AND MATERIALS RESEARCH DIRECTORATE
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This report presents the thermochemical characterization of Dow Derakane 411-C50 commercial vinyl-ester resin at low temperatures 20 deg - 40 deg C. Differential scanning calorimetry DSC and torsional braid analysis TBA are the experimental techniques used to characterize the material behavior. The cure kinetics are studied using DSC and are modeled using a modified autocatalytic equation with a maximum degree of cure term. Also, the effect of inhibitors in the resin system is accounted for by an inhibitor depletion model. A time-temperature-transformation diagram is constructed for the material by measuring the times to gelation and vitrification using TBA. The glass transition temperature Tsub g is also characterized using the TBA and related to the degree of cure. It was found that the Tsub g and the degree of cure do not exhibit a linear relationship for this resin system. The findings presented in this work provide information for accurate cure modeling and process simulation of vinyl-ester materials.