Thermal Characterization and Process Modification of an RTM Epoxy Resin
NAVAL AIR WARFARE CENTER AIRCRAFT DIV PATUXENT RIVER MD
Pagination or Media Count:
The Materials and Structures Division at NAVAIRSYSCOM have teamed together along with industry to demonstrate to a high level of confidence the viability of an agile resin transfer molding RTM manufacturing process, also know as intelligent processing, Utilizing fabrication, analysis, modeling and testing efforts, this program will provide an assessment of the Northwestern Universitys advanced injector system. This papers objective is to thermally characterize the selected SI-ZG-5A epoxy resin, formulated by A.T.A.R.D Laboratories. This analysis consists of a comprehensive program of resin characterization and cure modeling. Modulated Differential Scanning Calorimetry MDSC, rheology measurements and thermogravimetric analysis TGA were used to determine the cure kinetics, glass transitions, processing temperature and volatiles during cure. The manufacturers recommended cure cycle was followed in order to establish a reference glass transition, enthalpy of cure and gel point during cure. Once this analysis was complete, variations of the cure cycle were performed in order to determine if the cure cycle could be modified. Cure kinetics were also determined using the variable heating rate method. In conclusion, the SI ZG-5A resin system has been found to be a robust RTM resin by being forgiving of process variation. However, the effect of these variations on final mechanical properties is still be determined.
- Physical Chemistry