Readout Technology for > 1K x 1K Staring Focal Plane Arrays
RAYTHEON CO GOLETA CA
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Until recently very large focal plane arrays 1K x 1K pixels could only be fabricated using low density 2 micrometers CMOS processes employing frill wafer projection lithography. Higher density processes use steppers to expose the patterns on the wafer which have limited the die size to the area able to be exposed in a single step. This placed an upper limit on the readout die size of about 18-22 millimeters along a side. While stitching techniques have been used to pattern larger die most silicon foundries are unwilling to accept such projects.
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