Accession Number:

ADA383892

Title:

Interpenetrating Polymer Network (IPN) Adhesives for Electron Beam Cure

Descriptive Note:

Final rept. Jun-Dec 1999

Corporate Author:

ARMY RESEARCH LAB ABERDEEN PROVING GROUND MD WEAPONS AND MATERIALS RESEARCH DIRECTORATE

Report Date:

2000-09-01

Pagination or Media Count:

49.0

Abstract:

Electron beam e-beam-processed polymer adhesives have historically performed poorly compared to traditional adhesive technologies due to a lack of toughness engineered into these new types of adhesive materials. Consequently, sequential- and simultaneous-interpenetrating polymer networks Seq-IPN and SIN were developed and characterized. Seq-IPN adhesive pastes demonstrated exceptional lap-shear strengths approaching 41 MPa with glass transition temperatures T sub g of 100-120 deg. C. The sequential polymerization proceeds by first thermally curing the adhesive to the green-strength. The cure kinetics for the C-staged eq-IPNs have been investigated as a function of temperature and cure acceleration. SIN materials are being investigated to develop durable e-beam-curable film adhesives. The primary advantage of SIN film adhesives, compared to cationic e-beam systems, is insensitivity to surface contaminants e.g., amine and water, which are known to hinder cure in cationic e-beam polymerization. Preliminary results have shown that the SIN e-beam adhesives have excellent properties. Lap-shear strengths exceeding 27.5 MPa with adhesive T sub g approaching 150 deg. C have been demonstrated on primed aluminum substrates. Structural, kinetic, and adhesive performance data for both seq-IPN and SIN structural adhesives cured by e-beam irradiation are presented.

Subject Categories:

  • Adhesives, Seals and Binders

Distribution Statement:

APPROVED FOR PUBLIC RELEASE