Accession Number:

ADA371853

Title:

Interface Formation and Solid-Solid Reactions Induced by Cluster Ion Deposition

Descriptive Note:

Final rept. 1 Apr 96-30 Sep 99

Corporate Author:

UTAH UNIV SALT LAKE CITY DEPT OF CHEMISTRY

Personal Author(s):

Report Date:

1999-12-16

Pagination or Media Count:

14.0

Abstract:

Development is reported of a unique phase-space-compressing ion deposition beamline, coupled to an ultrahigh vacuum surface preparationanalysis system. The performance of the beamline in low energy focused deposition is discussed. A system of transferrable, high precision sample holders is described. An embedded-atom code developed for simulation of the cluster impact behavior is described. Initial results are presented for deposition, sticking, and penetration of copper atoms and copper dimers impacting on molybdenum and nickel over a wide range of collision energies.

Subject Categories:

  • Physical Chemistry
  • Atomic and Molecular Physics and Spectroscopy

Distribution Statement:

APPROVED FOR PUBLIC RELEASE