Accession Number:

ADA371758

Title:

High Thermal Conductivity Composite Structures

Descriptive Note:

Final rept. May-Nov 99

Corporate Author:

XC ASSOCIATES INC BERLIN NY

Personal Author(s):

Report Date:

1999-10-20

Pagination or Media Count:

20.0

Abstract:

The work accomplished in this SBIR project demonstrated that the addition of boron nitride BN powder to a composite laminate significantly increases the through the thickness thermal conductivity kz of a composite laminate. The importance of this work is that the improved kz results in significantly lower operating temperatures for thermal applications such as composite thermal planes for advanced electronic applications and space based radiators. The advantage of this material compared to competing materials that it can be used to fabricate high strength, high thermal conductivity, relatively thin structures less than 0.050 thick. Typical graphite fiber reinforced composite thermal planes have an in-plane thermal conductivity Kx Ky in the range 300-650 wmK, based on the fiber selection. But, the relatively low kz of a typical composite laminate significantly reduces the efficiency of the thermal plane due to the high impedance to getting heat in or out of the laminate. Finite element analysis of typical composite thermal planes shows that by increasing the kz from about 1 wmK for a typical laminate to about 4 wmK, as achieved in this project, results in temperature reductions in the order of 30.

Subject Categories:

  • Laminates and Composite Materials

Distribution Statement:

APPROVED FOR PUBLIC RELEASE