Accession Number:

ADA371559

Title:

Dielectric Relaxation Spectroscopy of Adhesively Bonded Joints

Descriptive Note:

Final rept. Sep 98-Jul 99

Corporate Author:

ADTECH SYSTEMS RESEARCH INC BEAVER CREEK OH

Report Date:

1999-08-01

Pagination or Media Count:

44.0

Abstract:

Prior to any microcracking or delamination in an adhesive bond, an aggressive hygrothermal environment can cause molecular level, chemical andor physical changes to the adhesive itself. This program was aimed at identifying the changes in the adhesive by the non-destructive test technique known as dielectric relaxation spectroscopy. In addition to identifying the changes in the adhesive by non-destructive techniques, the program was also aimed at determining the changes in the mechanical properties of an adhesive joint resulting from different levels of environmental exposure. These results were then to be correlated to the results obtained by the dielectric spectroscopy technique.

Subject Categories:

  • Adhesives, Seals and Binders
  • Couplers, Fasteners and Joints

Distribution Statement:

APPROVED FOR PUBLIC RELEASE