Channel Constrained Metalization Patterning of Reflective Backplane Electrodes for Liquid Crystal-on-Silicon Displays
GEO-CENTERS INC FORT WASHINGTON MD
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Channel Constrained Metalization CCM, which employs photoresist patterning to confine electroless metal deposition to selected regions, is an inexpensive alternative to metal sputtering or evaporation. Using CCM we deposited arrays of square nickel electrodes up to one micron in thickness and between 11 microns and 44 microns on the side. Gaps between the electrodes ranging from 1 micron to 4 microns were successfully patterned. In preliminary experiments, we have already achieved a reflectivity of up to 94 and an r.m.s. surface roughness of 3.3 nm evaluated on a pixel size 20 micron square area.
- Manufacturing and Industrial Engineering and Control of Production Systems
- Electrooptical and Optoelectronic Devices