Accession Number:

ADA361147

Title:

Thermal and Electro-Thermal Modeling and Simulation Techniques for Multichip Modules.

Descriptive Note:

Final rept.

Corporate Author:

TECHNICAL UNIV OF BUDAPEST (HUNGARY) DEPT OF ELECTRON DEVICES

Report Date:

1998-12-10

Pagination or Media Count:

38.0

Abstract:

This report results from a contract tasking Technical University of Budapest Department of Electron Devices as follows The contractor will investigate the issues and problems of coupled electro-thermal MS of Mixed Technology Multichip Modules MT-MCMs. MT-MCMs for this project will be defined as a mixtures of high performance computing, microelectromechanical systems, and microfluidic systems. The use of MS will be investigated for each of the generic steps of the design process flow as shown in the proposal. The contractor will determine the most cost effective MS approach for each step in the design process. The possibilities of integrating the existing fast and accurate design tools of TUB into the AFRL design flow have to be investigated, and the optimal MS approach determined.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE