Accession Number:

ADA359076

Title:

3-D Diamond MCM Technology Development Program

Descriptive Note:

Final technical rept. Oct 91-Nov 98

Corporate Author:

L AND O RESEARCH AND DEVELOPMENT CORP WAYNE PA

Personal Author(s):

Report Date:

1998-11-30

Pagination or Media Count:

98.0

Abstract:

3-D Diamond MCMs is an enabling technology to support chip-to-chip and module-to-module highdensity connectivity and thermal management. The extremely high conductivity of diamond, coupled with its electrically insulating nature, makes it an ideal choice for solving 3-D packaging problems. The thermal conductivity is so high as to allow over 80 Wcu in of power dissipation to be extracted from a stack of diamond substrates by lateral thermal conduction techniques alone. Diamond laterally conducts the heat generated by the logic out of the battle zone of the actively populated 3-D stack of MCMs. This frees the designer to fully utilize all of the space between boards to implement a high area density array of vertical z-axis interconnects between all adjacent boards in the stack to minimize interconnect delays. This report summarizes the design, fabrication, integration and testing of a Demonstration Test Bed that was utilized as a tool for testing and demonstrating the thermal management capability of diamond MCMs. A signal integrity analysis was also performed to illustrate the high speed signal viability through the z-axis 3-D interconnect structure itself. Supporting system design details, photographs of fabricated components and subsystems, and test results are provided.

Subject Categories:

  • Electrical and Electronic Equipment
  • Defense Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE