Accession Number:

ADA357789

Title:

Technology Development for Multilayered Microwave and Millimeter Wave Integrated Circuits

Descriptive Note:

Final rept.

Corporate Author:

POLYTECHNIC UNIV BROOKLYN NY DEPT OF ELECTRICAL ENGINEERING

Personal Author(s):

Report Date:

1998-10-31

Pagination or Media Count:

15.0

Abstract:

During the last three years of research we have contributed to the technology development for multilayer microwavemillimeter wave integrated circuits multilayer MMICs of the future. Such multilevel integration would allow implementation of smaller sized, higher density, and multi-functional microwavemillimeter wave circuits and systems, that are more reliable and cost effective. Specifically, we have 1 investigated new transmission media that are better suited for multilayer integration, where conventional techniques may not work properly, 2 developed novel geometries for efficient signal transition between circuit layers in a multilayer environment, 3 developed new antenna and feeding structures that are specifically meant to work with multilayer integration, and 4 developed new theory and analyticalcomputational models for the design of transmission lines, layer to layer coupling structures. multilayer antenna feeds, which will greatly support the future development of the multilayer MMIC technology. Our research shows, that there are several fundamental and technological issues that must be carefully considered to advance the multilayer microwavemillimeter wave integration concept. However, by using new techniques and devices, such as those developed by us, much more sophisticated and cost effective circuits and systems can be built to meet the future demands in radar and wireless telecommunication.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE