Accession Number:

ADA347631

Title:

Development and Packaging of Microsystems Using Foundry Services

Descriptive Note:

Doctoral thesis

Corporate Author:

AIR FORCE INST OF TECH WRIGHT-PATTERSONAFB OH SCHOOL OF ENGINEERING

Personal Author(s):

Report Date:

1998-06-01

Pagination or Media Count:

322.0

Abstract:

Micro-electro-mechanical systems MEMS are a new and rapidly growing field of research. Several advances to the MEMS state of the art were achieved through design and characterization of novel devices. Empirical and theoretical model of polysilicon thermal actuators were developed to understand their behavior. The most extensive investigation of the Multi-User MEMS Processes MUMPs polysilicon resistivity was also performed. The first published value for the thermal coefficient of resistivity TCR of the MUMPs Poly 1 layer was determined as 1.25 x 10exp -3K. The sheet resistance of the MUMPs polysilicon layers was found to be dependent on linewidth due to presence or absence of lateral phosphorus diffusion. The functional integration of MEMS with CMOS was demonstrated through the design of automated positioning and assembly systems, and a new power averaging scheme was devised. Packaging of MEMS using foundry multichip modules MCMs was shown to be a feasible approach to physical integration of MEMS with microelectronics. MEMS test die were packaged using Micro Module Systems MCM-D and General Electric High Density Intercounect and Chip-on-Flex MCM foundries. Xenon difluoride XeF2 was found to be an excellent post-packaging etchant for bulk micromachined MEMS. For surface micromachining, hydrofluoric acid HF can be used.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE