Accession Number:

ADA339986

Title:

High Temperature Superconductor MCM Process Development

Descriptive Note:

Final rept. 1 Oct 93-30 Sep 97

Corporate Author:

ARKANSAS UNIV FAYETTEVILLE HIGH DENSITY ELECTRONICS CENTER

Personal Author(s):

Report Date:

1998-03-18

Pagination or Media Count:

135.0

Abstract:

Two types of high-temperature superconducting HTS multichip modules MCMs utilizing yttrium-barium-copper oxide YBCO as the superconductor, were developed under this grant. The first was a flip mesh MCM, in which two superconducting layers, one containing X-running and one Y-running wire segments, were fabricated on separate substrates and joined in a manner similar to flip chips. The second module was a monolithic MCM, again using layers of X- and Y-running conductors, but patterned on a single substrate, with a thick layer of SiO2 serving as interlayer dielectric. Deposition of the second superconducting YBCO layer was effected by the use of an ion beam-assisted deposition IBAD buffer layer.

Subject Categories:

  • Electricity and Magnetism

Distribution Statement:

APPROVED FOR PUBLIC RELEASE