Algorithmic Solutions for Coupled Thermal and Electromagnetic Analysis
Final rept. Aug 95-Sep 96
SABBAGH ASSOCIATES INC BLOOMINGTON IN
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This effort investigated the strengths and weaknesses of current attempts at integrating data-representation and analysis techniques for electrical, electromagnetic, thermal and structural analysis of microelectronic components, principally microwave modules. Potential contributions and risks of various integration approaches were assessed. Constraints and opportunities associated with software implementation of this technology were also investigated. Guidelines, based on analytical and empirical studies, for efficiently solving coupled EM and TM problems were developed. Initial work focused on defining a suite of canonical models. Once these models were established, analytical studies were performed to identify constraints associated with integrated analyses of these models. Selected parametric values were varied to determine their effects on the analysis and to assess the sensitivity of the models. Of particular concern was the potential for the analysis to converge. A sequence-accelerating algorithm was applied to speed the convergence process. Empirical studies were performed to assess the conditions under which it was more appropriate to use two separate gridding structures rather than a single grid for both electrical and thermal analysis. Issues of adaptive meshing and extrapolation of solutions were also investigated.
- Electrical and Electronic Equipment
- Numerical Mathematics
- Radiofrequency Wave Propagation