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Thermal Management Research Studies. Volume 1. Electronics Cooling.
Final rept. Jun 91-Jan 96,
QUESTECH INC DAYTON OH
Pagination or Media Count:
An innovative cooling concept called venturi flow cooling has been introduced and developed for potential use in the thermal management of the advanced high power electronic devices. Single phase cooling medium is effectively used to create very high velocities in localized region of interest to improve heat transfer. Several different test apparatus have been built to investigate the heat transfer and flow phenomena. Using the venturi flow system and water, power devices, such as MCT and IGBT, were successfully tested at their rated current and frequency levels never possible with other cooling methods. Heat flux up to 257 Wsq. cm and heat transfer coefficient up to 13 Wsq. cm. deg C were demonstrated in this cooling system. This cooling technique is highly recommended for the future electronic cooling applications of the emerging more electric airplane systems involving very high intensity localized heat dissipation devices. This report presents the detailed descriptions of all aspects of this project.
APPROVED FOR PUBLIC RELEASE