Accession Number:

ADA324633

Title:

Semiconductor Packaging: A DoD Dual Use Technology Assessment.

Descriptive Note:

Final rept.,

Corporate Author:

DEPARTMENT OF DEFENSE WASHINGTON DC

Personal Author(s):

Report Date:

1995-01-01

Pagination or Media Count:

76.0

Abstract:

This assessment concludes that commercial capabilities for single-chip semiconductor packaging are sufficient to assure affordable access to meet military needs, and no action is required by the Department of Defense DoD. Driven by markets in telecommunications, computers, consumer electronics, and automotive systems, the integrated circuit IC packaging industry is able to provide the mainstream packaging technology required by the DoD. Although predominantly offshore, IC assemblers and equipment suppliers are highly competitive and diversified. Packaging materials suppliers are concentrated in Japan, but there has been no indication that access to materials will be limited or denied.

Subject Categories:

  • Electrical and Electronic Equipment
  • Containers and Packaging
  • Logistics, Military Facilities and Supplies

Distribution Statement:

APPROVED FOR PUBLIC RELEASE