Rome Laboratory Analysis of Components for Electronic Technologies for Cleaning in 1996 and Beyond,
ROME LAB ROME NY
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In the past, the manufacture of military microelectronics employed ozone depleting substances ODS during removal of solder fluxes from printed circuit PC boards. These ODS are environmentally unfriendly and were banned from use Montreal Protocol starting 1 Jan 96. Alternate flux removal technologies were studied by a Tri-Service, NASA, EPA, Industry, and Academia GTRI team. RLERDR was the Air Force representative on this team and was tasked with analysis of components from PC boards that had been processed with alternative cleaning methods and then stressed per test schedule. This effort served as a feasibility demonstration of producing reliable military microelectronics without the use of ODS. All boards in the test matrix were assembled with the different soldering technologies under study and were cleaned with the various chemistries proposed to replace ODS currently used. The matrix includes Mil, commercial, plastic and special ceramic coated dual NAND gates, Op-amps, and timer devices. Environmental Step-Stress ESS testing of boards was completed and selected parts removed for analysis at RLEEDR. Within the limited scope of the examinations and testing, no clear cleaning chemistry dependent reliability or potential reliability problems were detected.
- Solvents, Cleaners and Abrasives