Ceramic/Metal Composite Circuit Board Level Technology for Application Specific Electronic Modules (ASEMs).
Technical rept. 15 Dec 95-14 Mar 96,
DAVID SARNOFF RESEARCH CENTER PRINCETON NJ
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The task objective was to transfer the LTCC-M technology to a merchant circuit supplier, Alcoa Electronic Packaging, Inc. This task will require a steady supply of several custom glasses that were developed during the Phase 1 program. One or more glass producers will be qualified to supply materials to the David Sarnoff Research Center or its design to produce LTCC-M circuit boards and packages. The Phase 1 technology will be interactively transferred to Alcoa Electronic Packaging, who will be qualified by the fabrication of test structures and technology demonstration modules.
- Electrical and Electronic Equipment
- Solid State Physics