Accession Number:

ADA301449

Title:

Evaluation of Multilayer Printed Wiring Boards by Metallographic Techniques. An Illustrated Guide to the Preparation and Inspection of Plated-Through Hole Test Coupons Based on the Requirements of MIL-P-55llOD.

Descriptive Note:

Corporate Author:

NATIONAL AERONAUTICS AND SPACE ADMINISTRATION GREENBELT MD GODDARD SPACE FLIG HT CENTER

Personal Author(s):

Report Date:

1986-05-01

Pagination or Media Count:

73.0

Abstract:

This work is an illustrated handbook containing the rationale and procedure for the evaluation of multilayer printed wiring board construction integrity with respect to plated-through holes in accordance with the requirements of MIL-P-55l lOD, Printed Wiring Boards. Itis intended as a practical aid for those concerned with determining the construction integrity of multilayer boards for high reliability applications. Photomicrographs of cross-sectioned holes illustrate defect types, acceptable and unacceptable conditions, and methods of measurement. A procedure for specimen preparation is given, and appropriate paragraphs of the military specification are included and explained. AN

Subject Categories:

  • Electrical and Electronic Equipment
  • Metallurgy and Metallography

Distribution Statement:

APPROVED FOR PUBLIC RELEASE