Accession Number:
ADA300143
Title:
Liquefied Metal Jet Program (LMJP).
Descriptive Note:
Quarterly research and development status rept. 15 Jul-15 Oct 95,
Corporate Author:
TEXAS INSTRUMENTS INC DALLAS DEFENSE SYSTEMS AND ELECTRONICS GROUP
Personal Author(s):
Report Date:
1995-10-12
Pagination or Media Count:
8.0
Abstract:
Many significant technical issues have been overcome. Generation of test and evaluation coupons of 6337 solder circuit patterns on copper coupons have been accomplished on the Phase I system. Final fabrication and assembly of the copper system has been completed tested, and several attempts to generate copper spheres have been made. MM
Descriptors:
Subject Categories:
- Metallurgy and Metallography