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Manufacturing of High Speed Modulators for Dual-Use Communication Systems.

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Final rept. 1 Sep 94-28 Feb 95,

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The state-of-the art in electronics, ICs, and electrical interconnects has reached its limit in both clock speed and in the amount of data that can be processed in a single clock cycle. Clock speed is limited by clock skew, clock delay, and the many different path track lengths that an electrical signal must take in a PC board. The amount of processable data is limited by the number of pins on a high density IC package. For example, in state-of-the- art electronic printed circuit boards PCBs, or even multichip module MCM packaging, the speed-distance product and pin count are 5 GHz-cm and 500 pins per chip, respectively. Unfortunately, this figure of merit is much lower than what is immediately required to complete highly complex calculations for both military and commercial applications such as the modeling of turbulent flow over textured surfaces on missiles, bullets, fighter jets, rockets, etc., and for the fast and accurate prediction of weather patterns. Furthermore, current and projected electronic solutions offer only marginal or incremental improvements in speed and packaging, and thus will not fulfill the speed, distance, pin count, and density requirements of current and future imaging and data processing systems. Such systems include image processors used in rapid target recognition and missile interception medical image processing high definition TV HDTV image compression and ultra high-speed communication network switching related to Asynchronous Transfer Mode ATM schemes. KAR P. 5

Subject Categories:

  • Electrical and Electronic Equipment
  • Radio Communications

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