Micromechanical Measurement System for Thin Films on Polymeric Substrates. Phase 1.
Final rept. 10 Mar-9 Sep 94,
HYSITRON INC MINNEAPOLIS MN
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The overall objective of the Phase I project was to demonstrate the feasibility of building an instrument that would provide the combined capability of micromechanical testing and high resolution in situ imaging in a single instrument. The exact region of a sample could then be inspected and images recorded immediately before and after indenting or scratching without having to reposition the sample. The specific application of the instrument of interest to the Army was testing mechanical properties such as adhesion, scratch resistance and fracture resistance of very thin in the range of 0.l um hard films such as DLC on polymeric substrates such as polycarbonate. It was also anticipated that developing such an instrument, suitable for testing the described hard films, would be useful as a microhardnessmicromechanical test system for general purpose laboratory use with a wide range of materials of both commercial and theoretical interest. MM