Accession Number:

ADA291436

Title:

High Flux Heat Exchanger.

Descriptive Note:

Final rept. 30 Oct 91-31 Dec 93,

Corporate Author:

MCDONNELL DOUGLAS AEROSPACE ST LOUIS MO

Report Date:

1994-02-01

Pagination or Media Count:

121.0

Abstract:

This final report documents the results of the final two phases of a four-phase program to develop a high flux heat exchanger for cooling future high-performance aircraft electronics. Phases I and II, documented in interim report WL-TR-93-2027, defined future avionics cooling requirements and summarized a trade study of applicable cooling technologies. The Phase II trade study selected the Compact High Intensity Cooler CHIC for further development in Phases II and IV. This report describes the design, fabrication, and testing of the CHIC. The CHIC was designed to minimize system penalties weight, cost, etc. to a typical advanced fighter aircraft. Design objectives included a heat exchanger shape factor meeting Standard Electronics Module Format E SEM-E specification, local heat flux capability of 100 W sq cm, total module heat flux capability of 2000 W, maximum junction temperature of 90 deg C, and the use of poly alpha olefin PAO as the coolant. The CHIC was fabricated by diffusion bonding a stack of 24 copper alloy laminations of eight different patterns produced by photo-chemical etching. It was leak checked, proof-pressure tested, and then subjected to a series of thermal tests to verify performance. This was the first demonstration of 100 W sq cm local heat flux capability and 2000 W module capability using PAO. jg

Subject Categories:

  • Air Conditioning, Heating, Lighting and Ventilating
  • Attack and Fighter Aircraft
  • Polymer Chemistry
  • Properties of Metals and Alloys

Distribution Statement:

APPROVED FOR PUBLIC RELEASE