Development of Novel Curing Techniques for Thermosetting Polymers and Adhesives. Phase 2.
Final rept. 3 May 91-28 Aug 93,
SPRINGBORN LABS INC ENFIELD CT
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A novel induction curing technique for thermosetting polymers and adhesives was developed. This induction process provided a method for accelerating the cure rate of thermosetting adhesives so that they could be used as a replacement for mechanical fasteners in aluminum applications specifically the US Armys aluminum, Light Vehicle Foot Bridge. Potentially suitable thermosetting adhesives were procured for induction experiments. Various physical tests were used to rank the adhesives in order of their performance suitability. The induction process and the adhesives were optimized for rapid cure without detriment to the performance of the adhesive. Prototype bridge components, bonded with Dexter Hysol 9394 thermosetting adhesive were cured using the optimized induction process. These specimens were forwarded to the US Army, Fort Belvoir for performance evaluations. jg
- Polymer Chemistry
- Adhesives, Seals and Binders