Accession Number:

ADA288362

Title:

Advanced Packaging Concepts for Digital Avionics (Les Techniques Avancees de Mise Sous Boiter).

Descriptive Note:

Conference proceedings.

Corporate Author:

ADVISORY GROUP FOR AEROSPACE RESEARCH AND DEVELOPMENT NEUILLY-SUR-SEINE (FRAN CE)

Personal Author(s):

Report Date:

1994-10-01

Pagination or Media Count:

294.0

Abstract:

A critical impediment to significantly improving the performance of digital airborne electronics or avionics is the limitation posed by current electronics packaging concepts. This symposium brought together experts from seemingly diverse, but interlocking disciplines ranging from logisticians to digital designers to mechanical engineers to establish the current baseline in digital packaging, failure modes of the electronics and support problems. Trends in both supportability and processing were described for early 21st century application. Along with the projections of asymptotic increase in signal, image and data processing, dramatic increases in thermal densities, chip interconnects, correctors and backplane traffic were described. Current packaging approaches were shown to be totally inadequate, both from performance and supportability perspectives. A system solution for packaging light weight, ultra-reliable and high performance real time digital processing was presented. Papers were presented on how diverse new technologies could be integrated to provide a system solution. Avionics currently comprise almost one-third of the flyaway costs and over one-third of the support costs of modern day fighters. These percentages are expected to steadily grow unless fundamental changes are made in the manner in which avionics are designed, manufactured, packaged, tested and supported. Advanced packaging technologies hold promise for achieving greater performance while holding down costs. Significantly reduced costs will result from the standardized digital electronic modules which are used in all of the avionics sub-systems. If these modules can also be used in multiple weapon systems, then the large numbers required will drive down costs.

Descriptors:

• *AVIONICS
• *DATA PROCESSING
• *ELECTRONIC EQUIPMENT
• *PACKAGING
• THERMAL PROPERTIES
• DIGITAL SYSTEMS
• ELECTRONICS
• DENSITY
• SYMPOSIA
• WEAPON SYSTEMS
• AIRBORNE
• FAILURE
• REDUCTION
• COSTS
• SOLUTIONS(GENERAL)
• BASE LINES
• MODULES(ELECTRONICS)
• DAY
• DRIVES
• JET FIGHTERS
• LIGHTWEIGHT
• MECHANICAL ENGINEERING
• STANDARDIZATION

Subject Categories:

• Aircraft
• Electrical and Electronic Equipment
• Containers and Packaging

Distribution Statement:

APPROVED FOR PUBLIC RELEASE