Accession Number:

ADA285066

Title:

Ceramic/Metal Composite CIrcuit-Board-Level Technology for Application Specific Electronic Modules (ASEMs)

Descriptive Note:

Technical rept. 24 Jun-21 Sep 1994

Corporate Author:

DAVID SARNOFF RESEARCH CENTER PRINCETON NJ

Personal Author(s):

Report Date:

1994-09-21

Pagination or Media Count:

28.0

Abstract:

Most of the major elements of the LTCC-M technology have been developed, and all have been shown to be compatible. The development of the green tape ceramic has been completed. The materials and processing have been developed to fire this green tape to a CuMoCu metal core such that a very dense ceramic is formed with zero lateral x-y plane shrinkage. Thick film conductors have been developed for use with this tape. The process for mass fabrication of electrical feedthroughs in the CuMoCu core has been successfully extended to laser drilled holes as small as 7 mils in diameter. Additionally, thin film overlays with a photosensitive BCB from Dow Chemical dielectric have been deposited on top of the fired ceramic

Subject Categories:

  • Electrical and Electronic Equipment
  • Ceramics, Refractories and Glass
  • Laminates and Composite Materials
  • Metallurgy and Metallography

Distribution Statement:

APPROVED FOR PUBLIC RELEASE