Accession Number:

ADA282810

Title:

Diagnostic Techniques for Semiconductor Materials Processing. Materials Research Society Symposium Proceedings Held in Boston, Massachusetts on November 29-December 2, 1993. Volume 324

Descriptive Note:

Corporate Author:

MATERIALS RESEARCH SOCIETY PITTSBURGH PA

Personal Author(s):

• Glembocki, O. J.
• Pang, S. W.
• Pollak, F. H.
• Crean, G. M.
• Larrabee, G.

Report Date:

1994-05-01

Pagination or Media Count:

499.0

Abstract:

The symposium focused on various aspects of process diagnostics and device processing. Diagnostic techniques which were considered fell into two classes invasive and non invasive. Optical characterization techniques were the most widely applied characterization tools used in both materials and process monitoring. Techniques such as reflectance difference, ellipsometry, reflectance, absorption, light scattering, photoreflectance, Raman scattering and thermal wave modulated reflectance were shown to be powerful probes of various materials properties. The materials properties that were probed included surface stoichiometry and morphology, etch damage, Fermi level pinning position and thin film properties such as thickness, alloy content, and interfacial roughness. Real time diagnostics such as ellipsometry and reflectance difference were shown to be sensitive tools of materials properties during processing

Descriptors:

• *MATERIALS
• *SEMICONDUCTORS
• *DIAGNOSTIC EQUIPMENT
• THERMAL PROPERTIES
• EMISSION
• LIGHT SCATTERING
• OPTICAL PROPERTIES
• PROBES
• THICKNESS
• SYMPOSIA
• DAMAGE
• INTERFACES
• PROCESSING
• COMPOSITE MATERIALS
• MORPHOLOGY
• THIN FILMS
• ALLOYS
• ETCHING
• SURFACES
• ABSORPTION
• LANGMUIR PROBES
• ELLIPSOMETERS
• REFLECTANCE
• MODULATION
• WAVES
• RAMAN SPECTRA
• STOICHIOMETRY
• MASS SPECTROMETRY

Subject Categories:

• Electrical and Electronic Equipment
• Laminates and Composite Materials
• Optics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE