Accession Number:

ADA282298

Title:

Natural Convection Cooling of a Three by Three Array of Leadless Chip Carrier Packages in a Dielectric Liquid

Descriptive Note:

Master's thesis

Corporate Author:

NAVAL POSTGRADUATE SCHOOL MONTEREY CA

Personal Author(s):

Report Date:

1994-03-24

Pagination or Media Count:

132.0

Abstract:

Liquid cooling of a three-by-three array of commercially available leadless chip carrier packages, mounted on a ceramic substrate was examined. Baseline data were obtained for cooling with pure dielectric liquids. The effects of addition of high thermal conductivity ceramic powder to the liquid were next examined, both for natural and forced circulation conditions. Vertical and horizontal orientations were studied, for two different ceramic particle types, and two different particle sizes for each ceramic. For a range of chip power levels, chip, substrate and cold plate temperatures were measured. Interpretations for these data are provided. A numerical model was developed for the vertical geometry and compared to the measurements obtained. Immersion cooling, Ceramic, Electronics, Cooling, Enhancement, Natural convection, Forced convection.

Subject Categories:

  • Computer Hardware
  • Air Conditioning, Heating, Lighting and Ventilating

Distribution Statement:

APPROVED FOR PUBLIC RELEASE