Accession Number:
ADA281574
Title:
An Architecture for Intelligent Multichip Module Reliability Analysis
Descriptive Note:
Final rept. Mar 1992-Aug 1993
Corporate Author:
MASSACHUSETTS UNIV AMHERST
Personal Author(s):
Report Date:
1994-04-01
Pagination or Media Count:
46.0
Abstract:
This report describes the development of a computer-based modeling and analysis system called the Intelligent Multichip Module MCM Analyzer IMCMA. IMCMA is a blackboard-based software tool that automatically performs finite-element and knowledge-based analysis of MCM designs to rapidly assess their reliability. In IMCMA, modeling effort and expert-operator requirements have been reduced through 1 use of high-level representation of devices as the interface between the designer and the analysis tools 2 capturing the expertise of experienced design analysts in an intelligent assistant for use by less experienced designers. Nine knowledge sources KSs were completed that take a high-level device specification through model generation and simplification, finite-element generation, and thermal analysis. These KSs include stand-alone FORTRAN finite-element generation codes that have been integrated into IMCMA by using the generic blackboard framework, GBB. This initial IMCMA prototype quickly produces a thermal analysis when given a high-level MCM design description. Reliability, Thermal analysis, Design, Finite element analysis, FFA, Modeling, Multichip module, MCM, Blackboard, Artificial intelligence.
Descriptors:
Subject Categories:
- Computer Programming and Software
- Cybernetics