Accession Number:

ADA281574

Title:

An Architecture for Intelligent Multichip Module Reliability Analysis

Descriptive Note:

Final rept. Mar 1992-Aug 1993

Corporate Author:

MASSACHUSETTS UNIV AMHERST

Personal Author(s):

Report Date:

1994-04-01

Pagination or Media Count:

46.0

Abstract:

This report describes the development of a computer-based modeling and analysis system called the Intelligent Multichip Module MCM Analyzer IMCMA. IMCMA is a blackboard-based software tool that automatically performs finite-element and knowledge-based analysis of MCM designs to rapidly assess their reliability. In IMCMA, modeling effort and expert-operator requirements have been reduced through 1 use of high-level representation of devices as the interface between the designer and the analysis tools 2 capturing the expertise of experienced design analysts in an intelligent assistant for use by less experienced designers. Nine knowledge sources KSs were completed that take a high-level device specification through model generation and simplification, finite-element generation, and thermal analysis. These KSs include stand-alone FORTRAN finite-element generation codes that have been integrated into IMCMA by using the generic blackboard framework, GBB. This initial IMCMA prototype quickly produces a thermal analysis when given a high-level MCM design description. Reliability, Thermal analysis, Design, Finite element analysis, FFA, Modeling, Multichip module, MCM, Blackboard, Artificial intelligence.

Subject Categories:

  • Computer Programming and Software
  • Cybernetics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE