Accession Number:

ADA281450

Title:

Liquid Cooled Heat Sink with Through Vias (LCHS)

Descriptive Note:

Final rept. Dec 1992-Sep 1993

Corporate Author:

INTEGRATED SYSTEM ASSEMBLIES CORP WOBURN MA

Report Date:

1993-09-30

Pagination or Media Count:

32.0

Abstract:

A Liquid Cooled Heat Sink with Through Electrical Vias was designed fabricated and tested. The Heat Sink was designed for use in 3D stacks of high heat producing multichip modules. The report covers design considerations, the fabrication process and measured performance achieved A special section compares the Heat Sink performance to an equivalent diamond heat sink. A second special section discusses the economics of high volume production of the Heat Sink. Important performance results include 1 Power Density of 5OWcm2 with temperature rise of 15C. 2 100 thru vias per sq cm 3 Thickness of 1.25mm.

Subject Categories:

  • Electrical and Electronic Equipment
  • Air Conditioning, Heating, Lighting and Ventilating

Distribution Statement:

APPROVED FOR PUBLIC RELEASE