Accession Number:

ADA279787

Title:

The Reliability of Laser Reflowed Sn-Ag Solder Joints

Descriptive Note:

Quarterly rept. no. 1

Corporate Author:

RENSSELAER POLYTECHNIC INST TROY NY

Report Date:

1994-05-04

Pagination or Media Count:

5.0

Abstract:

This is the first quarterly report of a project aimed at determining the reliability of electronic interconnects made with Sn-3.5wtAg solder alloy. The reliability of solder interconnects is primarily determined by two factors 1 the type of electronic assembly and 2 the environment to which the assembly is exposed. These two factors each composed of several variables i.e. assembly thermal expansion coefficients, elastic moduli of assembly members, maximum operating temperature, rate of temperature change, etc. boil down to three critical parameters temperature, strain and strain rate or stress. The interdependence of these variables must first be explored when addressing a creep-fatigue problem such as the case of solder joints. Specific environment beyond temperature and state of stress at a propagating crack, which are determined by the specific application and package geometry, are being neglected at this point in time. Little involving the creep or fatigue properties of Sn-3. 5Ag is reported in the literature. Prior studies have used unique joint geometries to measure joint properties.

Subject Categories:

  • Inorganic Chemistry
  • Electrical and Electronic Equipment
  • Lasers and Masers
  • Computer Programming and Software

Distribution Statement:

APPROVED FOR PUBLIC RELEASE