Accession Number:

ADA279675

Title:

Dielectric Models in Adhesion and Extrapolations of Molecular Modeling

Descriptive Note:

Rept. for Jun 1993-Feb 1994

Corporate Author:

NAVAL AIR WARFARE CENTER WEAPONS DIV CHINA LAKE CA

Personal Author(s):

• Iwamoto, Nancy E.

Report Date:

1994-04-01

Pagination or Media Count:

40.0

Abstract:

In order to separate mechanical mechanisms of adhesion such as surface roughness, chain entanglement, or even chemical reaction from mechanisms based upon the dielectric nature of interface interaction, highlights of dielectric theory dealing with cohesion and adhesion are reviewed. Elements of those theories are applied in order to gain insight into experimental results of adhesive systems taken from the literature. From this analysis dielectric-based explanations are offered for general adhesion trends, including explanations of metal to nonmetal adhesion trends based upon properties of the changing metal and the constituents of the interface. An example of how a dielectric-based explanation could be used to rationalize contributions from both the interface compositions and bulk components is also given. Finally an example of dynamic molecular modeling is given in order to compare current computer models of adhesion.

Descriptors:

• *MODELS
• *ADHESION
• *DIELECTRICS
• *SURFACE ROUGHNESS
• *MOLECULAR PROPERTIES
• *COHESION
• METALS
• NONMETALS
• CHEMICAL REACTIONS
• THERMAL CONDUCTIVITY
• EXTRAPOLATION
• ADHESIVES
• GAIN
• CONSTANTS
• CHAINS
• INTERACTIONS
• COMPUTERS
• DYNAMICS
• INTERFACES

Subject Categories:

• Physical Chemistry
• Adhesives, Seals and Binders
• Electricity and Magnetism
• Mechanics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE