Accession Number:

ADA278622

Title:

Liquid Metal Cluster Ion Source Technology for Repair of Packaging Interconnects

Descriptive Note:

Interim rept. no. 1, 1 Oct-30 Nov 1993

Corporate Author:

S I DIAMOND TECHNOLOGY INC HOUSTON TX

Personal Author(s):

• Goruganthu, Rao
• Schmidt, Howard

Report Date:

1993-11-30

Pagination or Media Count:

5.0

Abstract:

We have proposed the development of a direct metal etch and write DMEW Technology based on recently developed liquid metal cluster ion sources LMCIS for repair of conducting paths in polymer and ceramic systems. This technology has been shown to be capable of depositing both gold and solder at deposition rates as high as 100,000 cubic microns per second at feature resolutions of 25-100 microns. The LMCISs advantages over competing direct write technologies, such as laser direct write and e-beam direct write, include high deposition rate no pre- or post-processing, good adhesion and almost bulk metallization resistivity. This high throughput and localized deposition capability will enable this technology to be useful in optical test and repair of multi-layer high density interconnect substrates and populated MCMs, bare die bumping, and personalization of semi-custom MCMs. The objectives of this project during phase I are to demonstrate the feasibility of this patented and proprietary direct write technology for repair of conducting paths in polymer and ceramic systems. In phase II we will develop a production worthy DMEW tool and related process technologies.

Descriptors:

• *REPAIR
• *CIRCUIT INTERCONNECTIONS
• *PACKAGING
• *ION SOURCES
• *LIQUID METALS
• METALS
• CONDUCTIVITY
• POLYMERS
• INTEGRATED CIRCUITS
• SUBSTRATES
• LASERS
• ETCHING
• CERAMIC MATERIALS
• DEPOSITION
• HIGH DENSITY
• GOLD
• SOLDERING

Subject Categories:

• Electrical and Electronic Equipment
• Metallurgy and Metallography
• Particle Accelerators

Distribution Statement:

APPROVED FOR PUBLIC RELEASE