Accession Number:

ADA275896

Title:

Design and Packaging of Fault Tolerant Optoelectronic Multiprocessor Computing System

Descriptive Note:

Annual progress rept. 15 Dec 1992-14 Dec 1993

Corporate Author:

CALIFORNIA UNIV SAN DIEGO LA JOLLA

Personal Author(s):

Report Date:

1993-12-14

Pagination or Media Count:

27.0

Abstract:

There is considerable interest in developing optical interconnects for multi-chip modules MCM. As a consequence, there is the basic need in developing a methodology for partitioning the system for effective utilization of the optical and electronic technologies. For the given netlist of a system design, key question to be answered is where to use optical interconnections. This paper introduces the Computer Aided Design CAD approach for partitioning opto-electronic systems into Opto-Electronic Multichip Modules OE MCM. We will first discuss the design tradeoff issues in optoelectronic system design including speed, power dissipation, area and diffraction limits for free space optics. We will then define a formulation for OE MCM partitioning and describe new algorithms for optimizing this partitioning based on the minimization of the power dissipation. The models for the algorithms are discussed in detail and an example of a multistage interconnect network is given. Different results, with the number and size of chips being variable, are presented where improvement for the system packaging has been observed when the partitioning algorithm are applied.

Subject Categories:

  • Computer Hardware

Distribution Statement:

APPROVED FOR PUBLIC RELEASE