Accession Number:

ADA275029

Title:

The Influence of Temperature on Microelectronic Device Failure Mechanisms. Phase 2

Descriptive Note:

Final rept.

Corporate Author:

RAMSEARCH CO CROFTON MD

Personal Author(s):

Report Date:

1993-09-04

Pagination or Media Count:

280.0

Abstract:

There has been a common belief that reliable electronics can be achieved by lowering temperature. Elevated temperature has in the past been considered a dominant stress that lowers reliability, so every effort has been made to lower operating temperature until the desired reliability is achieved. The belief in the harmful effects of temperature has woven itself into todays screening and thermal derating processes. High-reliability applications require that the microelectronic device be subjected to high-temperature stress screens, like burn-in, to improve the reliability of the product. Moreover, thermal derating measures for microelectronics often involve lowering temperature.

Subject Categories:

  • Electrical and Electronic Equipment
  • Mechanics
  • Thermodynamics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE