Accession Number:

ADA273720

Title:

The Formation of Conducting Gold Films by Thermal Decomposition and Direct Patterning Using Electron Beam Lithography of the Gold Cluster Au55P(C6H5)312Cl6

Descriptive Note:

Technical rept. Mar 92-Dec 93,

Corporate Author:

CHICAGO MAYOR'S COMMITTEE FOR ECONOMIC AND CULTURAL DEVELOPMENT IL

Report Date:

1993-12-06

Pagination or Media Count:

20.0

Abstract:

In this paper we present the fabrication and electrical conductivities of conducting gold cluster films. The films are deposited onto a Si3N4 substrate from a gold cluster solution by spin coating. After thermal decomposition and annealing at 180 deg C, a granular gold film with a resistivity of about 10exp-6 ohms-m is formed. Resistivity measurements as a function of temperature show a low residual resistivity ratio. The low temperature resistivity indicates an electron mean-free-path close to the cluster diameter, and the temperature dependent resistivity is found to be in agreement with the Block-Gruneisen model. The spin coated gold cluster film also acts as a negative electron beam resist. Fine structures as small as 0. micrometer can be patterned directly by electron beam exposure. The electron beam exposed structures were found not to be conducting even after chemical extraction and firing.

Subject Categories:

  • Inorganic Chemistry
  • Coatings, Colorants and Finishes
  • Electricity and Magnetism
  • Thermodynamics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE