Thin Films: Stresses and Mechanical Properties III. Materials Research Society Symposium Proceedings Held in Boston, Massachusetts on December 2-5, 1991. Volume 239
MATERIALS RESEARCH SOCIETY PITTSBURGH PA
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This volume consists of eight parts. Papers based on both oral and poster presentations are arranged according to these eight topics. The book begins with papers dealing with microstructural processes and intrinsic stresses in thin films. This is followed by papers on the stresses themselves and on thin film deformation processes. Mechanical testing techniques and the mechanical properties of thin films are presented next. Because indentation has become so important in the study of thin film mechanical properties, a special part of the symposium was devoted to modelling and experiments in indentation. The volume also includes a series of papers on the stresses and mechanical properties of multilayers, focusing mainly on metal multilayers with layer dimensions in the nanometer range. Strain relaxation in heteroepitaxial thin films by the formation of misfit dislocations continues to be one of the important research areas in this field, so a part of this volume is devoted to that topic. The last topics in the volume deal with failure processes in thin films. Papers on adhesion and fracture properties of thin films are grouped together in part VII. The last part of the book deals with the phenomena of electromigration and stress induced voiding in interconnect metal films.
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