Accession Number:

ADA261852

Title:

Special Technology Area Review on Microwave Packaging Technology

Descriptive Note:

Corporate Author:

PALISADES INST FOR RESEARCH SERVICES INC ARLINGTON VA

Personal Author(s):

Report Date:

1993-02-01

Pagination or Media Count:

41.0

Abstract:

Microwave MW and millimeter wave MMW multichip module MCM packaging is an emerging technology that is of great importance for both defense and commercial applications. Military applications such as radar, electronic warfare, communications, and smart munitions and commercial applications such as communications, direct broadcast satellite, cellular telephone, and automotive electronics all require MW andor MMW electronics. The spectrum of needs ranges from low volume, high performance electronics to high volume, low cost applications. A significant aspect of realizing these components and systems will be the development of a broad range of packaging and interconnect technologies that have the required reliability and environmental protection and are affordable and applicable to both the military and commercial sectors.

Subject Categories:

  • Electrical and Electronic Equipment
  • Radiofrequency Wave Propagation

Distribution Statement:

APPROVED FOR PUBLIC RELEASE