Reliability Assessment of Critical Electronic Components
Final rept. Mar 1989-Jun 1992
IIT RESEARCH INST ROME NY
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This document presents failure rate prediction procedures for resistors, capacitors, switches, inductive devices, relays, connectors, interconnection assemblies and rotating devices. Data were collected from military maintenance records, warranty records, published information and field operations to support the model development. The existing failure rate models were examined to identify areas that were deficient and needed to be updatedrevised. The objectives were 1 Be reflective of current state-of-the-art in part manufacturing technology 2 Include all part types being used in military systems 3 Be based only on information that is available during design phases 4 Be as accurate and precise as possible. The goal of the new model development was to simplify the models in a manner that made their complexity consistent with their precision and accuracy, while at the same time including provisions to account for the primary variable affecting reliability. A new prediction methodology was developed to model the failure rate of devices that exhibit wearout failure mechanisms i.e., switches, relays, etc.. Additional new part types have been added i.e., ceramic chip capacitors, tantalum chip capacitors, etc. which may be included in MIL-HDBK-217E.
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems