Electronic Manufacturing Process Improvement (EMPI) for Printed Wiring Assemblies
Final rept. Aug 1990-Jan 1991
TRW MILITARY ELECTRONICS AND AVIONICS DIV SAN DIEGO CA
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This Task 2 Technical Operating Report describes, in detail, the specific experiments that will be conducted under this contract on the integrated manufacturing process for surface mount technology SMT printed wiring assemblies PWAs at TRW MEAD. This detail includes 1 The investigate methods used to design the experiments such as full- and fractional factorial techniques 2 The printed wiring board PWB design, the component selection and layout, the defect data to be collected, and the inspection criteria used to collect the defect data and 3 The applicable control limits and the tolerance budgets related to the integrated SMT PWA process flow.
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems