Electronic Manufacturing Process Improvement (EMPI) for Printed Wiring Assemblies
Final rept. Aug 1990-Jul 1991
TRW MILITARY ELECTRONICS AND AVIONICS DIV SAN DIEGO CA
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This Task 3 Technical Operating Report is comprised of three basic sections. The first section is an overall description of the Electronic Manufacturing Process Improvement EMPI for Printed Wiring Assemblies PWAs Program. Included is a description of the PWA design, continuous process improvement, and the seven basic experimental approach. The second section presents the results obtained by performing the statistically designed experiments described in the second technical report for this Electronic Manufacturing Process Improvement Program, Program Task 2 Project Description Report dated February 1991. The second section also presents the analyses performed on those results, and identifies the process capability indices Cp and Cpk for the seven processes evaluated. It includes a discussion and conclusion of the analyses, and process capability indices determined from the experimental data. It describes the final, statistically designed experiment that is being run as the wrap-up to this phase of the EMPI for PWAs Program. This experiment will be run to demonstrate and quantity the process improvements achieved as a result of applying design of experiments DOE methodology to TRW- MEADs surface mount printed wiring assembly operation. The third section is the Appendices which contain the Cost Benefits Analysis for this program and the finalized detailed experimental plans for the seven experiments run under Task 3 of this program. Printed Wiring Assemblies PWAs, Electronic Manufacturing Process Improvement EMPI, Design of Experiments DOE, Printed Wiring Board PWB, Solder Joint, Tinning, Fine Pitch Device FPD.
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems